Weighted transaction card

ABSTRACT

Weighted transaction cards and methods of manufacturing the same. The weighted transaction cards may include a tungsten member that comprises at least a portion of a layer of the transaction card. The tungsten member may be encapsulated and/or disposed in an opening of a surround to define an inlay. The inlay may be laminated with one or more additional layers according to traditional card manufacturing techniques (e.g., a hot lamination process). The weighted transaction cards may have a weight significantly greater than traditional plastic transaction cards.

RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.16/278,612, filed on Feb. 18, 2019, entitled “WEIGHTED TRANSACTIONCARD,” which is a continuation of U.S. patent application Ser. No.15/690,704, filed Aug. 30, 2017, entitled “WEIGHTED TRANSACTION CARD,”which is a continuation of U.S. patent application Ser. No. 15/234,733,filed Aug. 11, 2016, issued as U.S. Pat. No. 9,779,343 on Oct. 3, 2017,entitled “WEIGHTED TRANSACTION CARD,” which is a continuation of U.S.patent application Ser. No. 14/834,200, filed Aug. 24, 2015, issued asU.S. Pat. No. 9,430,724 on Aug. 30, 2016, entitled “WEIGHTED TRANSACTIONCARD,” which is a continuation of U.S. patent application Ser. No.14/501,386, filed Sep. 30, 2014, issued as U.S. Pat. No. 9,117,155 onAug. 25, 2015, entitled “WEIGHTED TRANSACTION CARD,” which is acontinuation of U.S. application Ser. No. 13/840,621 filed Mar. 15,2013, issued as U.S. Pat. No. 8,857,722 on Oct. 14, 2014, entitled“WEIGHTED TRANSACTION CARD,” which claims benefit of priority to U.S.Provisional Patent Application No. 61/674,143 filed Jul. 20, 2012,entitled “WEIGHTED TRANSACTION CARD,” all of which applications areincorporated herein by reference in their entirety.

FIELD OF THE INVENTION

The prevalence of the use of transaction cards continues to grow. Withthe increasing use of transaction cards by individuals for value inpurchases, the market for different types of transaction cards alsocontinues to grow.

In this regard, a number of different varieties of cards are offered toconsumers that may each offer a unique set of benefits and features. Forexample, a number of ultra-premium transaction card types have beenproposed that are marketed to individuals with high net worth that alsoestablish large balances using a transaction card. Card issuers thatoffer such ultra-premium transaction card types often provide associatedpremium services to holders of such ultra-premium transaction cards suchas, for example, concierge services, increased involvement rewardsprograms, increased travel benefits, consumer protection features withrespect items purchased using such cards, or other ultra-premiumservices not typically offered with standard transaction cards.

In addition to ultra-premium services offered in connection with suchtransaction cards, card issuers may also wish to provide a premiumphysical card as evidence of the ultra-premium nature of the transactioncard. In fact, the awareness of such ultra-premium transaction cards hasgrown to the point where such ultra-premium cards have become associatedwith the high net worth individuals to whom such cards are issued. Inthis regard, such ultra-premium cards have become status symbols formany individuals.

To further increase the exclusivity of such cards and to differentiatesuch cards from traditional transaction cards, it has been proposed tomanufacture cards using different precious metals rather than thetypical plastic materials employed in traditional cards. For example,titanium, palladium, other precious metals, or the like have beenproposed to be used to construct ultra-premium transaction cards.However, to produce precious metal cards of the kind proposed for use inthe ultra-premium transaction card market, it is often the case thattraditional methods of card manufacture are not applicable. In turn, thecost of such cards is often much greater than the cost associated withthe production of traditional transaction cards made from plastics andthe like. For example, art work and other indicia (e.g., accountnumbers, a name associated with the account, expiration dates,verification codes, terms and conditions, and/or other necessaryindicia) associated with a transaction card may be provided on atransaction card. In the case of metallic cards, such art work and/orother indicia may be directly created in the precious metal of the cardby such processes as laser etching, machining, etching, or otherrelatively costly processes. It has further been proposed that layersincluding the transaction card indicia be adhered to the metalsubstrate. However, each of these approaches requires costlymanufacturing techniques not normally associated with the production oftransaction cards such that the cost for each card may be much more thantraditional transaction cards. Furthermore, the cost of the rawmaterials for precious metal cards may be much greater than thematerials used to construct traditional plastic cards. In this regard,many card issuers that offer ultra-premium transaction cards of thisnature do not directly recoup the increased production costs of suchcards when offering such cards to individuals (e.g., by way of fixedinitiation fees or annual fees) with the understanding that the high networth individuals to whom the card is offered will more than likely usethe transaction card to a degree so as to provide substantial revenue tothe card issuer despite the loss associated with the production of thecard. However, the reach of such ultra-premium cards has beencorrespondingly limited to a relatively small portion of the transactioncard market as a result of the difficulty in large scale manufacture ofultra-premium cards.

SUMMARY

The present disclosure generally relates to weighted transaction cardsthat may provide characteristics (e.g., corresponding to the look and/orfeel of the card) that provide an ultra-premium quality to transactioncards that may be satisfying to a card user. However, in contrast toprevious ultra-premium transaction card production techniques, theweighted transaction cards described herein may employ traditional cardmanufacturing techniques in their construction so as to significantlyreduce the costs associated with production of such cards. In thisregard, a card with detectable physical properties (e.g., the weight ofthe card) that are evident when the card is handled may be produced forcosts much less than traditional ultra-premium cards made from preciousmetals and may be produced for costs approaching the cost of traditionalplastic cards. In this regard, such weighted transaction cards mayprovide a similar impression of quality or an ultra-premium naturewithout the high production costs normally associated with ultra-premiumtransaction cards. As such, the segment of the market to which suchweighted cards may be economically offered may be much greater than thesegment of the market to which traditional ultra-premium cards areoffered.

In this regard, a first aspect presented herein includes a transactioncard in which at least a portion of a first layer of the transactioncard comprises a metal portion. The transaction card may also include asecond layer that may be attached to the first layer.

In an embodiment, the second layer may be adhered to at least part of alateral extent of a side of the metal portion. In an application, themetal portion may be substantially homogenous. In this regard, the metalportion may comprise a solid metal member. In an implementation, themetal portion may be single piece member. In an embodiment, the metalportion may comprise a tungsten member. In this regard, at least aportion of the tungsten member may comprise tungsten. For example, in anembodiment, at least a majority of the tungsten member may comprisetungsten. In some preferred applications, the tungsten member maycomprise at least 75%, at least 80%, at least 85%, or even at least 90%tungsten.

In an embodiment a weight of the tungsten member may comprise at leastabout 40% of the total weight of the transaction card, and in anotherimplementation, the weight of the tungsten member may comprise at leastabout 50% of the total weight of the transaction card. In an embodiment,the total weight of the tungsten member may comprise less than about 90%of the total weight of the transaction card, and in another application,the total weight of the tungsten may comprise less than about 80% of thetotal weight of the transaction card. In an implementation, the weightof the tungsten member may be at least about 8 g, and in an embodiment,the weight of the tungsten member may be at least about 10 g. In anembodiment, the weight of the tungsten member may be less than about22.6 g, and in a certain implementation the weight of the tungstenmember may be less than about 14 g. In an embodiment, the total weightof the transaction card may be at least about 10 g, and in animplementation the total weight of the transaction card may be at leastabout 15 g. In an embodiment, the total weight of the transaction cardmay be less than about 25 g, and in an application, the total weigh ofthe transaction card may be less than about 20 g.

In an embodiment, for a given deflection test, the weighted transactioncard may undergo a reduction in deflection of at least about 30% fromthe deflection of a traditional plastic transaction card, and in anapplication, the weighted transaction card may undergo a reduction indeflection of at least about 40% from the deflection of a traditionalplastic transaction card. In an application, for a given test, theweighted transaction card may undergo a reduction in deflection of lessthan about 90% from the deflection of a traditional plastic transactioncard, and in an application, the weighted transaction card undergo areduction in deflection of less about 80% from the deflection of atraditional plastic transaction card.

In a characterization, the weighted card may be deflectable, e.g.,substantially elastically deformable, between a planar configuration andan arcuate configuration along at least a portion of a length of thecard (e.g., corresponding with the longitudinal axis thereof), whereinthe arcuate configuration has a radius of curvature of about 68 mm (2.7in) or less. In an implementation, the weighted card may be deflectable,e.g., substantially elastically deformable, between a planarconfiguration and an arcuate configuration along at least a portion of awidth of the card (e.g., corresponding with a cross-axis that istransverse, e.g., normal, to the longitudinal axis of the card), whereinthe arcuate configuration has a radius of curvature of about 68 mm (2.7in) or less.

In an embodiment, the weighted card may be deflectable, e.g.,substantially elastically deformable, through an angle of at least about3° per 5.1 mm (0.2 in), and preferably at least about 4.5° per 5.1 mm(0.2 in), along a length of the card (e.g., corresponding with thelongitudinal axis thereof). In the same or other embodiments, theweighted card may be deflectable, (e.g., substantially elasticallydeformable) through an angle of at least about 5° per 5.1 mm (0.2 in),and preferably at least about 7.5° per 5.1 mm (0.2 in), along a width ofthe card (e.g., corresponding with a cross-axis that is transversely,e.g., normal to the longitudinal axis of the card). In animplementation, the weighted card may be deflectable, e.g.,substantially elastically deformable, through an angle of less thanabout 20° per 5.1 mm (0.2 in), along a length of the card (e.g.,corresponding with the longitudinal axis thereof), and preferably lessthan about 18.5° per 5.1 mm (0.2 in), along a length of the card (e.g.,corresponding with the longitudinal axis thereof). In the same or otherembodiments, the weighted card may be deflectable, (e.g., substantiallyelastically deformable) through an angle of less than about 15° per 5.1mm (0.2 in), and preferably less than about 12° per 5.1 mm (0.2 in),along a width of the card (e.g., corresponding with a cross-axis that istransversely, e.g., normal to the longitudinal axis of the card).

In an embodiment, the thickness tungsten member may be at least about0.127 mm (0.005 in), and in an application, the thickness of thetungsten may be at least about 0.191 mm (0.0075 in). In an embodiment,the tungsten member may be less than about 0.4064 mm (0.016 in), and inan implementation, the tungsten member may be less than about 0.254 mm(0.010 in). In an embodiment, the tungsten member comprises a length atleast about 50% of the length of the transaction card, and in anapplication, the length of the tungsten member may be at least about 70%of the length of the transaction card. In an embodiment, the tungstenmember may comprise a length less than about 90% of the length of thetransaction card, and in an implementation, the tungsten member maycomprise a length less than about 85% of the length of the transactioncard.

In an embodiment, the tungsten member may comprise a width at leastabout 50% of the width of the transaction card, and in animplementation, the tungsten member may comprise a width at least about60% of the width of the transaction card. In an embodiment, the tungstenmember may comprise a width less than about 90% of the width of thetransaction card, and in an implementation, the tungsten member maycomprise a width less than about 80% of the width of the transactioncard.

In an embodiment, the tungsten member may comprise a length of at leastabout 42.8 mm (1.69 in). In an application, the tungsten member maycomprise a length of less than about 77.0 mm (3.03 in). In anembodiment, the tungsten member may comprise a width of at least about27.0 mm (1.06 in). In an application, the tungsten member may comprise awidth of less than about 48.6 mm (1.91 in).

In an embodiment, the first layer may include a surround into which themetal portion (e.g., the tungsten member) is inlaid. In this regard, thesurround may define an opening into which the tungsten member isreceived. Accordingly, the surround may include at least a first edgedefining the opening that is adjacent to an edge of the tungsten member.In an embodiment, the opening may include a corresponding number ofedges as the tungsten member such that the opening is shaped incorresponding relation to the tungsten member. In this regard, thetungsten member may abut the surround along each edge of the tungstenmember.

In an embodiment, the opening may extend through the surround so as todefine an aperture extending therethrough. In this regard, the thicknessof the tungsten member may be substantially the same as the thickness ofthe surround. Accordingly, opposing major planes of the tungsten membermay be coplanar with corresponding opposing major planes of the surroundonce the tungsten member is inlaid with respect to the surround. Assuch, the tungsten member and surround may define an inlay layer havinga first side and a second side. The first side and the second side mayhave substantially continuous planar surfaces along the opposing majorplanes of the tungsten member and the surround.

In an embodiment, an encapsulant may be disposed about the metal portion(e.g., tungsten member). For example, the encapsulant may secure thetungsten member in inlaid relation relative to the surround. In thisregard, the encapsulant may extend between edges of the tungsten memberand edges of the opening of the surround. In an embodiment, theencapsulant may also extend along the major planes of the tungstenmember (e.g., in a case where the tungsten member is thinner than thesurround). In any regard, once applied, the encapsulant may create asubstantially continuous planar surface along the first and second sidesof the inlay layer. The inlay layer may also include a film layerapplied along the first and second sides thereof. The film layers may beapplied directly to the surround and the tungsten member or may beapplied to the surround and the encapsulant covering the tungstenmaterial. In an embodiment, one or more graphics layers may also beattached to the inlay layer. For example, the one or more graphicslayers may comprise indicium indicative of an account associated withthe transaction card.

In an embodiment, the encapsulant may have a hardness at least about 30%of the hardness of the tungsten member, and in an implementation, theencapsulant may have a hardness at least about 50% of the hardness ofthe tungsten member. In an application, the encapsulant may have ahardness less than about 95% of the hardness of the tungsten member, andin an implementation, the encapsulant may have a hardness less thanabout 85% of the hardness of the tungsten member. In an embodiment, theencapsulant may have a modulus of elasticity at least about 30% of themodulus of elasticity of the tungsten member, and in an implementation,the encapsulant may have a modulus of elasticity at least about 50% ofthe modulus of elasticity of the tungsten material. In an embodiment,the encapsulant may have a modulus of elasticity of less than about 95%of the modulus of elasticity of the tungsten member, and in anapplication, the encapsulant may have a modulus of elasticity less thanabout 85% of the modulus of elasticity of the tungsten material.

The encapsulant may include at least one of an epoxy, a resin, athermoset polymer, a thermoplastic polymer or the like. For example, invarious embodiments, the encapsulant may comprise at least one ofpolypropylene, nylon, polyester, ethylene-polyurethane, polyvinylbutyrate, vinyl chloride, silicone, polyvinyl alcohol, polyvinyl methylether, nitrocellulose, polyamide, bismaleimide, polyimide, epoxypolyester hybrid, and/or the like.

In an embodiment, the surround may comprise at least one of polyvinylchloride (PVC), oriented polyester, polyethylene terephthalate,biaxially-oriented polyethylene terephthalate, or polycarbonate. In anembodiment, the tungsten member may comprise sintered tungsten.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 depicts an embodiment of a tungsten member as disposed in anopening of a surround.

FIG. 2 depicts an embodiment wherein the tungsten member may be securedwith respect to the surround by way of an encapsulant.

FIG. 3 depicts an embodiment of an inlay.

FIG. 4 depicts a cross section of an embodiment of an inlay taken at theboundary of a tungsten member and a surround.

FIG. 5 depicts an embodiment of a plurality of layers of an embodimentof a transaction card.

FIG. 6 depicts an embodiment of a transaction card undergoing a hotlamination process.

FIGS. 7-8 depict various examples of bulk processing of transactioncards.

FIG. 9 depicts an embodiment of a tungsten member disposed in a surroundhaving a relief portion provided therein.

FIG. 10 depicts an embodiment of a tungsten member disposed in asurround, where the tungsten member has a relief portion and thesurround has a corresponding projection.

FIG. 11 depicts the embodiment of FIG. 10, with a milled pocket providedin the surround for receipt of a device.

FIG. 12. depicts another embodiment of a tungsten member with a reliefportion in which a pocket for receiving a device is milled.

FIG. 13 depicts an embodiment of a tungsten member disposed in asurround having an antenna for wireless communication in a resultingtransaction card disposed therewith.

FIGS. 14A and 14B depict cross sectional embodiments of the embodimentof FIG. 13 taken along section line 14-14 in FIG. 13.

FIG. 15 depicts an embodiment of a transaction card show with an edge ofa surround showing at an edge of the transaction card

FIG. 16 depicts the placement of a tungsten member relative to a machinereadable indicia in an embodiment of a transaction card.

FIG. 17 depicts an embodiment of a transaction card having a transparentmember extending relative to a portion of a tungsten member having asurface finish.

DETAILED DESCRIPTION

The following description is not intended to limit the invention to theforms disclosed herein. Consequently, variations and modificationscommensurate with the following teachings, skill and knowledge of therelevant art, are within the scope of the present invention. Theembodiments described herein are further intended to explain modes knownof practicing the invention and to enable others skilled in the art toutilize the invention in such, or other embodiments and with variousmodifications required by the particular applications(s) or use(s) ofthe present invention.

The present disclosure generally relates to weighted cards and methodfor manufacturing the same, and in particular to weighted transactioncards that may be used for value in purchases and methods formanufacturing such weighted transaction cards. Specifically, the presentdisclosure includes cards that include a weighted mass that may compriseat least a portion of a layer of a card. In an embodiment, the weightedmass may be a metallic member. For example, the metallic member maycomprise stainless steel, palladium, platinum, gold, silver, ortungsten. In an embodiment, the weighted mass may be a tungsten member.Tungsten may be preferred as the weighted mass because tungsten includesadvantageous properties including high density, relatively goodworkability, and non-toxicity. Accordingly, while reference may be madeherein to a tungsten member, it may be appreciated that the descriptionmay generally apply to any weighted member (e.g., a weighted membercomprising any potential metal described above).

In this regard, a tungsten member that may be incorporated into atransaction card of traditional dimensions may impart significant weightto the finished transaction card. In an embodiment, the tungsten membermay be encapsulated such that it is in turn processable by traditionalmethods used in the production of transaction cards. For example, theencapsulated tungsten member may be processed using traditional hotlamination techniques to laminate the tungsten member with additionalcard layers. Accordingly, a relatively heavy card (e.g., at least twice,but more preferably 3 to 4 times the weight of a normal transactioncard) may be produced relatively inexpensively, using traditional cardprocessing techniques. In contrast, proposed approaches to use ofmetallic members in cards may not utilize traditional high volume cardproduction techniques such as hot lamination and may in turn rely oncostly techniques such as cold rolling, milling, and or other customapproaches to card production.

As depicted in FIG. 1, a weighted mass comprising a tungsten member 10may be inlaid into a surround 22 as depicted in FIG. 1. For example, thetungsten material 10 may comprise primarily tungsten with somepreferably small amount of one or more of nickel, iron, copper, or othermaterial. Such additional materials may be present in the tungstenmember 10 to increase the workability of the tungsten member 10. Assuch, the tungsten member 10 may be provided in a relatively thin platethat may correspond in size to a finished transaction card as will bediscussed in greater detail below. The tungsten member 10 may be produceby way of a sintering process to form the tungsten member 10. Thesurround 22 may comprise, for example, a polymer material. Examples ofpolymeric materials that may comprise the surround may include polyvinylchloride (PVC), polyethylene glycol (PEG), oriented polyester,biaxially-oriented polyethylene terephthalate (e.g., Melinex® availablefrom DuPont Teijin Films), polycarbonate, or other appropriate materialknown the card processing art.

The surround 22 may include an opening 20 that may be sized incorresponding relation to the tungsten member 10 so as to accommodatethe tungsten member 10 in the opening 20. In this regard, the tungstenmember 10 may be received, or inlaid, in the opening 20 of the surround20. Relatedly, the thickness of the tungsten member 10 may be equal toor less than the thickness of the surround 22 about the opening 20. Theopening 20 may be sized to be slightly larger dimensionally in lengthand width than the tungsten member 10 such that the tungsten member 10may be received by the opening 20 as depicted in FIG. 2.

An encapsulant 30 may be applied to the tungsten member 10 and/orsurround 22 so as to fill any space between the tungsten member 10 andthe surround 22 as depicted in FIG. 2. The encapsulant 30 may comprise amaterial that is applied and subsequently allowed to harden tosubstantially encapsulate the tungsten member 10 to secure the tungstenmember 10 within the opening 20 of the surround 22. While depicted inFIG. 2 as being disposed between the tungsten material 10 and thesurround 22, it will be appreciated that the encapsulant 30 may, in someembodiments, also substantially surround, or enclose, the tungstenmaterial 10 and/or the surround 22 (i.e., cover all sides thereof). Inthis regard, the tungsten member 10 may include a surface finish topromote adhesion of the encapsulant 30 and/or a film layer 40 (describedin greater detail below). Further still, the surface finish may bedecorative and at least partially visible in the finished transactioncard as described in greater detail below.

In various embodiments, different materials 30 may be used as theencapsulant 30 to secure the tungsten member 10 in an inlaid fashionwith respect to the surround 22. For example, the encapsulant 30 maycomprise one or more of epoxy, resin, a thermoset polymer, athermoplastic polymer, or the like. For example, specific examples mayinclude polypropylene, nylon, polyester, ethylene-polyurethane,polyvinyl butyrate, vinyl chloride, silicone, polyvinyl alcohol,polyvinyl methyl ether, nitrocellulose, polyamide, bismaleimide,polyimide, epoxy polyester hybrid, and/or the like.

Furthermore, the encapsulant 30 may be chosen to have properties topromote adhesion with respect to the tungsten member 10. In this regard,an encapsulant 30 having properties chosen so as to prevent the tungstenmember 10 from separating from the surround 22. For example, it may beappreciated that when the tungsten member 10 and the surround 22 areflexed, the tungsten member 10 and the surround 22 may undergo differentamounts of deflection for a given force applied. By matching theencapsulant to the tungsten material 10, the amount of differentialflexing the tungsten member 10 and the surround 22 undergoes may beminimized to as to reduce the tendency of the tungsten member 10 toseparate from the surround 22 once encapsulated with respect thereto. Inthis regard, it may be appreciated that any separation of the tungstenmember 10 from the surround 22 may result in processing defects later inthe card manufacture process corresponding to for example, ghosting ofgraphics, separation of card layers, or other defects.

Therefore, it may be desirable to maintain the tungsten member 10 inlaidwithin the envelope of the surround 22 defined by opening 20. In thisregard, the encapsulant 30 may assist in maintaining the tungsten member10 inlaid with respect to the surround 22. Accordingly, encapsulant 30may be chosen to have a hardness and/or flexing properties (e.g., amodulus of elasticity) close to or within a predetermined range of thehardness and/or modulus of elasticity of the tungsten member 10.

For example, the hardness of the tungsten member 10 may be or mayapproach 2570 MPa on the Brinell hardness scale and the modulus ofelasticity may be or may approach approximately 411 GPa. Accordingly, inan embodiment, the encapsulant 30 may have a hardness that is at leastabout 30% of the hardness of the tungsten member 10, and in animplementation the encapsulant 30 may have a hardness at least about 50%of the hardness of the tungsten member 10. In an application, theencapsulant 30 may have a hardness less than about 95% of the hardnessof the tungsten member 10, and in an embodiment, the encapsulant 30 mayhave a hardness less than about 85% of the hardness of the tungstenmember 10. In an embodiment, the encapsulant 30 may have a modulus ofelasticity that is at least about 30% of the modulus of elasticity ofthe tungsten member 10, and in an implementation the encapsulant 30 mayhave a modulus of elasticity at least about 50% of the modulus ofelasticity of the tungsten member 10. In an application, the encapsulant30 may have a modulus of elasticity less than about 95% of the modulusof elasticity of the tungsten member 10, and in an embodiment, theencapsulant 30 may have a modulus of elasticity less than about 85% ofthe modulus of elasticity of the tungsten member 10.

In an embodiment, the tungsten member 10 may be sized in correspondingrelation to the size of a finished card. For example, the InternationalOrganization for Standardization (ISO) may promulgate standardsgoverning the size and/or properties for finished transaction cards. Forexample, ISO 7810 and/or ISO 7816, both of which are incorporated hereinby reference, may specify transaction cards be 85.60 mm (3.375 in) inlength by 53.98 mm in width (2.125 in) by 0.76 mm (0.030 in) inthickness. As used herein, the term “length” may correspond to thegreatest dimension of the object, the term “width” may correspond to thenext smallest dimension of the object than the length, and the term“thickness” may refer to the smallest dimension of the object.Therefore, as stated above, in an embodiment, the tungsten member 10 mayhave length, width, and height dimensions that are in correspondingrelation relative to the finished transaction card in which the tungstenmember 10 is incorporated. In an embodiment, the tungsten member 10 mayhave a length that is at least about 50% of the length of thetransaction card, and in an implementation the tungsten member 10 mayhave a length that is at least about 70% of the length of thetransaction card. In an application, the tungsten member 10 may have alength that is less than about 90% of the length of the transactioncard, and in an embodiment, the tungsten member 10 may have a lengththat is less than about 85% of the length of the transaction card. In anembodiment, the tungsten member 10 may have a width that is at leastabout 50% of the width of the transaction card, and in animplementation, the tungsten member may have a width that is at leastabout 60% of the width of the transaction card. In an embodiment, thetungsten member 10 may have a width that is less than about 90% of thewidth of the transaction card, and in an implementation, the tungstenmember 10 may have a width that less than about 80% of the width of thetransaction card. In an embodiment, the tungsten member 10 may have athickness that is at least about 10% of the thickness of the transactioncard, and in an implementation, the tungsten member 10 may have athickness that is at least about 20% of the thickness of the transactioncard. In an application, the tungsten member 10 may have a thicknessless than about 40% of the thickness of the transaction card, and in anembodiment, the tungsten member 10 may have a thickness that is lessthan about 35% of the thickness of the transaction card. In a preferredembodiment, the tungsten member 10 may have a thickness that is at leastabout 30% of the thickness of the transaction card.

In an application, the tungsten member 10 may have a width of not lessthan about 30% and not more than about 60% of the width of thetransaction card. In this regard, as shown in FIG. 16, the tungstenmember 10 may be provided in nonoverlapping relative relation withrespect to a machine readable field 242 of the card. In FIG. 16, theposition of the tungsten member 10 in the finished transaction card isshown in ghosted lines. In this regard, it may be appreciated that thetungsten member 10 may be provided in the nonoverlapping relativerelation with respect to the machine readable field 242 to, for example,prevent interference with the reading of the machine readable field 242(e.g., such as by a magnetic reader in the case of a magnetic stripe).As may be appreciated, a reduction in the width of the tungsten member10 may be provided with a corresponding increase in the thickness and/orlength of the tungsten member 10 to maintain a weight of the card.

In an embodiment, the length of the tungsten member 10 may be at leastabout 42.8 mm (1.69 in). In an application, the length of the tungstenmember 10 may be less than about 77.0 mm (3.03 in). In an embodiment,the width of the tungsten member 10 may be at least about 27.0 mm (1.06in). In an application, the width of the tungsten member 10 may be lessthan about 48.6 mm (1.91 in). In an embodiment, the thickness of thetungsten member 10 may be at least about 0.127 mm (0.005 in). In anapplication, the thickness of the tungsten member 10 may be less thanabout 0.254 mm (0.030 in). In a preferred embodiment, the tungstenmember 10 may have dimensions of about 73.025 mm (2.875 in) in length by41.275 mm (1.625 in) in width by 0.254 mm (0.010 in) in thickness.

In an embodiment, the tungsten member 10 may have a density of at leastabout 15.0 g/cm³. In an implementation, the tungsten member 10 may havea density less than about 19.3 g/cm³. In a preferred embodiment, thetungsten member 10 may have density of about 17.5 g/cm³. In anembodiment, the tungsten member 10 may weigh at least about 8 g, and inan application, the tungsten member 10 may weigh at least about 10 g. Inan application, the tungsten member may weigh less than about 22.6 g,and in an implementation, the weight of the tungsten member 10 may beless than about 14 g. In an embodiment, the weight of the tungstenmember 10 may represent at least about 40% of the overall weight of thetransaction card, and in an implementation, the tungsten member 10 mayrepresent at least about 50% of the overall weight of the transactioncard. In an embodiment, the tungsten member 10 may weigh less than about90% of the overall weight of the transaction card, and in animplementation, the weight of the tungsten member 10 may represent lessthan about 80% of the overall weight of the transaction card. In anembodiment, the overall weight of the transaction card may be at leastabout 10 g, and in an implementation, the overall weight of thetransaction card may be at least about 15 g. In an embodiment, theoverall weight of the transaction card may be at least about 25 g, andin an application, the overall weight of the transaction card may beless than about 20 g. Traditional plastic transaction cards maytypically weigh between 4.5 g and about 5.2 g. Accordingly, in anembodiment, a weighted transaction card comprising a tungsten member 10may weigh at least about two times a traditional plastic transactioncard, and in a preferred embodiment, the weighted transaction card mayweigh at least 3 times. In an application, the weighted transaction cardmay weigh less than about five times a traditional plastic transactioncard.

In an embodiment, the transaction card may have a substantially evenweight distribution across at least a portion of a first dimension(e.g., a length of the card). For instance, the card may have asubstantially even weight distribution across at least about 60% of thelength of the card. In a more preferred embodiment, the card may have asubstantially even weight distribution across at least about 80% of thelength of the card. Additionally, the transaction card may have asubstantially even weight distribution across at least a portion of asecond dimension (e.g., a width of the card). For instance, the card mayhave a substantially even weight distribution across at least about 60%of the width of the card. In a more preferred embodiment, the card mayhave a substantially even weight distribution across at least about 80%of the width of the card. The tungsten member 10 may be shaped, sized,and/or positioned relative to the transaction card so that the center ofmass of the tungsten member 10 coincides with the centroid of thetransaction card.

Additionally, it may be appreciated that a transaction card including atungsten member 10 may be have a weight distribution that issubstantially balanced at least along one dimension of the card. Forexample, the tungsten member 10 may be sized, shaped, and/or disposed tohave symmetric weight distribution along a dimension of the transactioncard. For instance, the weight of a first portion of the card along afirst half (e.g., a left side) of a dimension (e.g., a lengthcorresponding with the largest dimension of the transaction card) may besubstantially the same as the weight of the transaction card along aportion of the card along a second half (e.g., a right side) of adimension. By substantially the same, the weight of the first half maybe no less than about 40% and not more than about 60% of the totalweight of the card. The dimension may be the length, width, or thicknessof the card. In this regard, the transaction card may have relativelyuniform weight along the length of the card. In an embodiment (e.g.,where the tungsten member 10 is disposed in nonoverlapping relativerelation to a machine readable field), the transaction card may have aweight balance that is nonsymetric along another dimension of the card(e.g., along the width). That is, a first half of the card along a width(e.g., the top) of the card may be lighter than a second half of thecard along a width (e.g., the bottom). However, this imbalance of weightalong the width may not affect the weight distribution along the length,such that the weight distribution as determined along the length isstill balanced along the length.

Further still, a weighted transaction card including the tungsten membermay be more rigid than a traditional plastic transaction card. That is,a weighted transaction card may deflect a lesser amount for any givenforce applied to the weighted card. The amount of flexibility of a cardmay be quantified in a number of ways. In a first regard, the card maybe secured along one side thereof (e.g., along a short side of the cardcorresponding to the width or along a long side of the cardcorresponding to length). A force may then be applied at an end of thecard opposite end of the secured edge. In turn, the amount of deflectionof the card may be measured once the force is applied to quantify theflexibility of the card. In another method of quantifying theflexibility of the card, the card may be exposed to an axial load in thedimension corresponding to the card length or an axial load in thedimension corresponding to the card width. This may result in the cardbowing. The amount of deflection of the card (i.e., the distance whichthe card bows) may be measured as a deflection. In either of theforegoing methods, a weighted transaction card may undergo less of adeflection for a given force in such a test than a traditional plastictransaction card. In an embodiment, for a given test, the weightedtransaction card may undergo a reduction in deflection of at least about30% from the deflection of a traditional plastic transaction card, andin an application, the weighted transaction card may undergo a reductionin deflection of at least about 40% from the deflection of a traditionalplastic transaction card. In an application, for a given test, theweighted transaction card may undergo a reduction in deflection of lessthan about 90% from the deflection of a traditional plastic transactioncard, and in an application, the weighted transaction card undergo areduction in deflection of less about 80% from the deflection of atraditional plastic transaction card.

In a characterization, the weighted card may be deflectable, e.g.,substantially elastically deformable, between a planar configuration andan arcuate configuration along at least a portion of a length of thecard (e.g., corresponding with the longitudinal axis thereof), whereinthe arcuate configuration has a radius of curvature of about 68 mm (2.7in) or less. In an implementation, the weighted card may be deflectable,e.g., substantially elastically deformable, between a planarconfiguration and an arcuate configuration along at least a portion of awidth of the card (e.g., corresponding with a cross-axis that istransverse, e.g., normal, to the longitudinal axis of the card), whereinthe arcuate configuration has a radius of curvature of about 68 mm (2.7in) or less.

In an embodiment, the weighted card may be deflectable, e.g.,substantially elastically deformable, through an angle of at least about3° per 5.1 mm (0.2 in), and preferably at least about 4.5° per 5.1 mm(0.2 in), along a length of the card (e.g., corresponding with thelongitudinal axis thereof). In the same or other embodiments, theweighted card may be deflectable, (e.g., substantially elasticallydeformable) through an angle of at least about 5° per 5.1 mm (0.2 in),and preferably at least about 7.5° per 5.1 mm (0.2 in), along a width ofthe card (e.g., corresponding with a cross-axis that is transversely,e.g., normal to the longitudinal axis of the card). In animplementation, the weighted card may be deflectable, e.g.,substantially elastically deformable, through an angle of less thanabout 20° per 5.1 mm (0.2 in), along a length of the card (e.g.,corresponding with the longitudinal axis thereof), and preferably lessthan about 18.5° per 5.1 mm (0.2 in), along a length of the card (e.g.,corresponding with the longitudinal axis thereof). In the same or otherembodiments, the weighted card may be deflectable, (e.g., substantiallyelastically deformable) through an angle of less than about 15° per 5.1mm (0.2 in), and preferably less than about 12° per 5.1 mm (0.2 in),along a width of the card (e.g., corresponding with a cross-axis that istransversely, e.g., normal to the longitudinal axis of the card).

With further reference to FIG. 3, a film layer 40 may be applied to thesurround 22 and the tungsten member 10 inlaid with respect to thesurround 22 to further secure the tungsten member 10 within the opening20. For example, the film layer 40 may assist in a lamination process aswill be described in greater detail below. The film layer 40 may be, forexample, a polyester, polyvinyl chloride (PVC), polypropylene,polyethylene, acrylic, polycarbonate, and/or the like. The film layer 40maybe, but is not required to be, transparent. The assembly includingthe tungsten member 10 inlaid and encapsulated within the opening 20 ofthe sheet 22 and the film layers 40 applied thereto may be referred toas inlay 100.

In this regard, with further reference to FIG. 4, a cross sectional viewof the inlay 100 is shown along the boundary between the tungsten member10 and the surround 22. In this regard, it may be appreciated that theopening 20 of the surround 22 may be sized so as to provide some spacebetween the tungsten member 10 and the surround 22. This space may befilled with the encapsulant 30 to secure the tungsten member 10 in theopening 20. While not shown in FIG. 4, as described above in someembodiments, the encapsulant 30 may substantially surround the tungstenmember 10 (i.e., extend along all sides thereof) such that a layer ofencapsulant 30 may also extend along the tungsten member 10 between thefilm layer 40 and the tungsten member 10.

Turning to FIG. 5, the inlay 100 may be provided between a graphics 210layer and a second graphics layer 220. That is, the first graphics layer210 may be disposed adjacent to a first side of the inlay 100 and thesecond graphics layer 220 may be disposed adjacent to a second side ofthe inlay 100. The first graphics layer 210 and/or the second graphicslayer 220 may be printable layers onto which graphics (e.g., logos,designs, photos, etc.) may be printed. Such graphics may be printedusing any known printing technique known in the art such as, forexample, screen printing, Gravure printing, lithography, inkjetprinting, laser printing, etc. Of note, the graphics layers 210 and 220may be printed or otherwise produced using traditional high volume cardproduction techniques. The second graphics layer 220 may include agraphics field 222 (e.g., containing terms and conditions or otherindicia associated with the finalized transaction card).

Furthermore, the inlay 100, the first graphics layer 210, and the secondgraphics layer 220 may be disposed between a first transparent filmlayer 230 and a second transparent film layer 240. The first transparentfilm layer 230 may include graphics and/or data fields corresponding tothe finished transaction card. For example, as shown in FIG. 5, anaccount number 212, an account owner data field 214, one or moreauthenticity indicia 216 (e.g., holograms or the like), and/or agraphics field 218 may be printed or otherwise disposed (e.g., appliedby way of adhesive or the like) on the first transparent film layer 230.In this regard, the first transparent film layer 230 may includepersonalization or the like related to a card account and/or card owner.Note that the personalization may be provided via traditional highvolume production techniques such as any of the foregoing printingtechniques, hot stamping, application of holograms, etc. The secondtransparent film layer 240 may include a machine readable field 242and/or a signature field 244 printed thereon. The machine readable field242 may be written with data corresponding to, for example, indiciaindicative of an account to which the transaction card is associated orother information related to the transaction card. The signature field244 may provide a surface on which the user of the card may write (e.g.,to sign the card as part of a verification process).

With further reference to FIG. 6, the first transparent film layer 230,the first graphics layer 210, the inlay 100, the second graphics layer220, and the second transparent film layer 240 may be disposed into alamination press 300. The lamination press 300 may include first andsecond platens 310 between which the various layers are disposed. Theplatens 310 may include different surface finishes that face the layersstack (e.g., including the transparent film layers 230 and 240, thegraphics layers 210 and 220 and the inlay 100) so as to apply a surfacefinish to the transaction card upon completion of the lamination. Forexample, a mirrored finish (resulting in a gloss finish on the card) ora satin finish (resulting in a satin finish on the card) may be providedon the platens 310. It may be appreciated that a satin finish may bepreferred in at least some embodiments. In this regard, the satin finishon the finished transaction card may reduce the likelihood that“ghosting” of the tungsten member 10 is visible on the exterior surfacesof a finished transaction card. That is, a slightly rougher surface(e.g., a non-glossy surface) may result in any ghosting that may occurwith respect to the tungsten member 10 being minimized. In this regard,the surface finish of the finished transaction card may be not less thanabout 0.15 mircometers (6 microinches) and not more than about 0.403micrometers (15.9 microinches). Additionally or alternatively, one ormore different finishes may be provided on the platens 310 (e.g.,including the incorporation of designs or the like by altering thefinishes on a given portion of the platen 310).

In any regard, heat and pressure may be applied to the platens 310 inthe direction of arrows 320 such that the layer stack becomes laminated.That is, the application of heat and pressure to the first transparentfilm layer 230, the first printable layer 210, the inlay 100, the secondprintable layer 220, and the second transparent film layer 240 mayresult in the lamentation of the various layers resulting in a finishedcard body. The hot lamination process may include one or more phases ofapplication of heat and/or pressure. For example, during a first phase aconstant temperature may be applied to the layer stack at a constantpressure. During a second phase, a constant temperature (e.g., lowerthan the temperature of the first phase) may be applied and the pressuremay be continuously or periodically increased during the second phase.Additional phases including different and/or variable temperaturesand/or pressures may be applied to laminate the layer stack.

While the foregoing process focused on the production of a singletransaction card, it will be appreciated that the process describedabove may be completed in a bulk manner. In this regard, with furtherreference to FIG. 7, the inlay 100 may include a plurality of portionscorresponding to individual finished transaction cards. In this regard,the plurality of portions corresponding to individual cards may undergothe foregoing process and be later separated (e.g., by way of cutting orpunching out the individual card portions). Accordingly, as shown inFIG. 7, a plurality of tungsten members 10 may be inlaid with respect toa plurality of openings 20 of a surround 22. Accordingly, the surround22 may receive a plurality of tungsten members 10 that may eachcorrespond to an individual card portion. The inlay 100 including theplurality of individual card portions may be processed similarly asdescribed above (i.e., disposed between first and second graphics layers210 and 220 as well as first and second transparent film layers 230 and240) and laminated in a bulk operation. In this regard, the first andsecond graphics layers 210 and 220 as well as first and secondtransparent film layers 230 and 240 may also have individual cardportions including the features described above in relation to eachlayer for each individual card portion. Accordingly, once the inlay 100including the plurality of individual card portions has undergone thelamination process, the individual finished cards may be separated fromthe resulting bulk card sheet. For example, a sheet including 28 or 56card portions may be provided.

In an implementation, a transaction card may be provided that includesan inset device. The inset device may include, for example, a smart cardchip or the like. In an implementation, the inset device may be an EMVchip, a Mifare chip, or other inset device provided on the card. It willbe appreciated that when integrating inset devices with transactioncards, the card may be milled to provide a pocket. Accordingly, asdepicted in FIG. 9, the tungsten member 10 may include a relief portion12. The relief portion 12 may provide a space in which a pocket may bemilled in a finished card to accommodate an inset device. In thisregard, the relief portion 12 of the tungsten member 10 may be sized andpositioned so as to avoid any portion of the tungsten member 10interfering with the milling process. As shown in FIG. 9, encapsulant 30may be provided in the space defined by the relief portion 12. In animplementation depicted in FIG. 10, the surround 22 may include aprojection 24 that extends into the space defined by the relief portion12. In any regard, as shown in FIG. 11, a pocket 26 may be milled toaccommodate in inset device (e.g., an EMV chip). While the pocket 26 isshown in FIG. 12 as being milled into the projection 24 of the surround22, it may also be appreciated that the encapsulant 30 disposed in thespace defined by the relief portion 12 may also be milled. Furtherstill, while the inlay 100 is shown as being milled in FIG. 11, this maybe for illustration purposes only. In this regard, it may be appreciatedthat the finished transaction card (e.g., after lamination) may bemilled such that additional layers are milled that are not shown in FIG.11. In this regard, an inset device may be disposed in the pocket 26.

FIG. 12 shows an embodiment of an inlay 100 where a relief portion 12 isprovided that comprises an opening in the tungsten member 10. That is,the relief portion 12 shown in FIG. 12 may be provided such that thetungsten member 10 surrounds the relief portion 12. In this regard, therelief portion 12 need not be positioned at an edge of the tungstenmember 10. The relief portion 12 may be filled with encapsulant 30 andsubsequently milled to produce a pocket 26 for receiving an insetdevice. Alternatively, a plug or other portion of material (e.g., asimilar material to that of surround 22) may be provided in the reliefportion 12 that is milled to produce the pocket 26.

Further still, with reference to FIG. 13, the inlay 100 may be providedwith an antenna 28 (e.g., to facilitate wireless or contactlesscommunication with a finished transaction card). With further referenceto FIGS. 14A and 14B, various embodiments of the positioning of theantenna 28 relative to the inlay 100 are shown. For example, as shown inFIG. 14A, the antenna 28 may be disposed on a surface of the surround22. In this regard, the antenna 28 may be provided directly on thesurface of the surround 22 (e.g., by way of a deposition process or viaan adhesive). While not shown, the antenna 28 may be provided on a layerthat extends relative to the inlay 100 (e.g., the antenna 28 andassociated substrate may form a layer of the card).

Additionally, as shown in FIG. 14B, the antenna 28 may be inset relativeto the surround 22. In this regard, the surround may be formed orprocessed to include a recess that accommodates the antenna 28. Therecess may be milled from the surround 22. In this regard, the antenna28 may be provided at least partially inset into the surround 22 suchthat the antenna 28 may not add to the thickness of the finished card.

Additionally, with reference to FIG. 15, it may be appreciated that in afinished transaction card, an edge of a surround 22 may be at leastpartially exposed at an edge of the transaction card. That is, thelayers of the first graphics layer 210, the surround 22, and the secondgraphics layer 220 may each be visible at an edge of the finishedtransaction card. In this regard, it may be appreciated that the colorsof these layers may be selected to match or contrast. For example, in anembodiment, the color of the surround 22 may be chosen to contrast fromat least one of the first graphics layer 210 or the second graphicslayer 220 so that the contrasting color of the surround 22 may bevisible at a portion of the edge of the finished card. In otherembodiments, the color of the surround 22 may be chosen to match thecolor of at least one of the first graphics layer 210 or the secondgraphics layer 220 such that the visible portion of the surround 22 atthe edge of the finished transaction card may match the edge color ofthe first graphics layer 210 or the second graphics layer 220.

In an embodiment, the graphics layers 210 and/or 220 and the surround 22may be substantially opaque. In this regard, in an embodiment of thetransaction card, the tungsten member 10 may not be visible at anexterior of the card. That is, the tungsten member may be completelyencapsulated by opaque portions such that the tungsten member is notvisible.

In another embodiment, the transaction card may include a transparent ortranslucent portion so that at least a portion of the tungsten member 10is visible at an exterior of a transaction card including the tungstenmember. As such, with reference to FIG. 17, a front side of a card isshown such that a graphics layer 210 is visible. The graphics layer 210may include a transparent portion 250. In this regard, the tungstenmember 10 may be visible through the transparent portion 250. As may beappreciated, the transparent portion 250 may be disposed some distancefrom the edge of the graphics layer 210. That is, the transparentportion 250 may include a border 260 surrounding the transparent portion250. In this regard, the border 260 may be substantially opaque. Assuch, the border 260 may cover an interface between the tungsten member10 and the surround 22. In this regard, an edge portion of the tungstenmember 10 may be obscured by the border 260. As may be appreciated, ifthe tungsten member 10 includes a surface roughness (e.g., a textured,potentially decorative surface roughness), the surface roughness may bevisible through the transparent portion 250. While one side (e.g.,corresponding to the first graphics layer 210) is shown, it may beappreciated that such a transparent portion 250 may be provided oneither or both sides of a transaction card.

It may be further appreciated that ISO 7810 and/or ISO 7816,incorporated by reference above, may also prescribe requirements for thephysical characteristics of cards such as bending stiffness,flammability, toxicity, resistance to chemicals, car dimensionalstability and warpage with temperature and humidity, resistance todeterioration from exposure to light and heat, and durability. It may beappreciated that the foregoing weighted transaction cards and methods ofmanufacturing the same may result in finished transaction cards thatmeet the standards set forth in ISO 7810, ISO 7816, and/or any otherregulations, rules, or standards applicable to transaction cards.

The foregoing description of the present invention has been presentedfor purposes of illustration and description. Furthermore, thedescription is not intended to limit the invention to the form disclosedherein. Consequently, variations and modifications commensurate with theabove teachings, and skill and knowledge of the relevant art, are withinthe scope of the present invention. The embodiments describedhereinabove are further intended to explain known modes of practicingthe invention and to enable others skilled in the art to utilize theinvention in such or other embodiments and with various modificationsrequired by the particular application(s) or use(s) of the presentinvention. It is intended that the appended claims be construed toinclude alternative embodiments to the extent permitted by the priorart.

1. A transaction card, comprising: a metallic member inlaid with respectto a surround to define an inlay layer having a first side and a secondside; a first film layer applied to the first side of the inlay layer; asecond film layer applied to the second side of the inlay layer; a firstgraphics layer laminated to the first film layer on the first side; anda second graphics layer laminated to the second film layer on the secondside; wherein at least one of the first graphics layer or the secondgraphics layer comprises indicium indicative of an account associatedwith the transaction card.
 2. A transaction card according to claim 1,wherein the metallic member comprises at least one of a tungsten orsintered tungsten. 3.-5. (canceled)
 6. A transaction card according toclaim 5, wherein the weight of the metallic member is at least one of:not less than about 8 g and not more than about 22.6 g; or not less thanabout 10 g and not more than about 14 g.
 7. (canceled)
 8. A transactioncard according to claim 6, wherein the total weight of the transactioncard is not less about 10 g and not more than about 25 g.
 9. Atransaction card according to claim 8, wherein the metallic membercomprises a thickness not less than about 0.127 mm (0.005 in) thick andnot more than about 0.305 mm (0.012 in). 10.-13. (canceled)
 14. Atransaction card according to claim 9, wherein the metallic membercomprises: a length of not less than about 42.8 mm (1.69 in) and notmore than about 77.0 mm (3.03 in); and a width of not less than about27.0 mm (1.06 in) and not more than about 48.6 mm (1.91 in). 15.-22.(canceled)
 23. A transaction card according to claim 1, wherein: thesurround comprises at least one of polyvinyl chloride (PVC), orientedpolyester, polyethylene terephthalate, biaxially-oriented polyethyleneterephthalate, or polycarbonate; and the film layer comprises at leastone of polyester, PVC, polypropylene, polyethylene, acrylic,polycarbonate.
 24. A transaction card according to claim 1, wherein thefirst graphics layer and the second graphics layer are laminated to thefirst film layer, the second film layer and the inlay layer by way of ahot lamination process.
 25. A transaction card according to claim 24,wherein a surface finish of the transaction card is not less than about0.15 mircometers (3.93 microinches) and not more than about 1 micrometer(39.4 microinches). 26.-38. (canceled)
 39. A transaction card accordingto claim 1, wherein the metallic member comprises a relief portion of asize corresponding to an inset device to be provided on the transactioncard and the surround comprises a corresponding projection extendingwith respect to the relief portion. 40.-41. (canceled)
 42. A transactioncard according to claim 39, wherein the transaction card comprises amilled pocket in an area corresponding to the relief portion, whereinthe milled pocket is configured to accommodate an inset device. 43.-44.(canceled)
 45. A transaction card according to claim 1, wherein themetallic member comprises a surface roughness of not less than about 0.1mircometers (6 microinches) and not more than about 1.0 micrometers(15.9 microinches).
 46. A transaction card according to claim 45,wherein the surface roughness of the metallic member comprises a patternconsisting of at least one of: a brushed metal, a diamond plate, or ageometric pattern.
 47. A transaction card according to claim 1, furthercomprising: An antenna member disposed between the first graphics layerand the second graphics layer, wherein the antenna member is at leastone of a discrete layer in the transaction card or at least partiallyembedded in the surround. 48.-49. (canceled)
 50. A transaction card,comprising: a tungsten member; a polyvinyl chloride (PVC) film layercoupled to at least a first side and a second side of the tungstenmember and with the tungsten member defining a first layer; and anindicia layer attached to the first layer comprising at least oneindicium indicative of an account associated with the transaction card,wherein the indicia layer is laminated to the PVC film layer on thefirst side and the second side of the tungsten member. 51.-52.(canceled)
 53. A transaction card according to claim 50, wherein theweight of the tungsten member is one of: not less than about 8 g andless than about 22.6 g; or not less than about 10 g and not more thanabout 14 g; or not less than about 10 g and not more than about 25 g.54.-55. (canceled)
 56. A transaction card according to claim 50, whereinthe tungsten member is not less than about 0.127 mm (0.005 in) and notmore than about 0.305 mm (0.012 in). 57.-60. (canceled)
 61. Atransaction card according to claim 56, wherein the tungsten membercomprises: a length of not less than about 42.8 mm (1.69 in); and awidth of not less than about 27.0 mm (1.06 in). 62.-67. (canceled)
 68. Amethod for producing a weighted transaction card, comprising: inlaying atungsten member with respect to a surround; applying a film layer ontothe tungsten member and the surround to define an inlay layer; disposingthe inlay layer between first and second graphic layers; applying heatand pressure to the first graphic layer, the inlay, and the secondgraphic layer; and laminating the first graphic layer, the inlay, andthe second graphic layer in response to the applying of the heat andpressure to form the weighted transaction card, wherein the film layerassists in laminating the first graphic layer, the inlay, and the secondgraphic layer to one another.
 69. A method according to claim 68,wherein the laminating is performed free from cold rolling.
 70. A methodaccording to claim 68, further comprising: separating the weightedtransaction card from a sheet of material. 71.-74. (canceled)